Conclusions on Sn-Pb Properties

The material that was summarized in this section illustrates the intricacies involved in the development of constitutive and life prediction models for SnPb solders and assemblies. As of yet, the corresponding knowledge-base for lead-free solders is not as extensive and much work remains to be done to develop adequate constitutive and life prediction models for SnAg and SAC electronic solder joints. The following sections are strictly focused on reviewing material properties and mechanical behavior of those two alloys. While covering a wide range of data, this review is by no means exhaustive.