NIST Home Page MML Home Page Navigational links also at page bottom
 
Introduction  
Sn-Pb Properties and Models  
Sn-Ag Properties and Creep Data  
Sn-Ag-Cu Properties and Creep Data  
General Conclusions/ Recommendations  
Acknowledgements  
References  
     
  For more information contact:  
  metallurgy@nist.gov  
 

References

  • Clech, J-P., "BGA, Flip-Chip and CSP solder joint reliability", in Proceedings, MicroMat2000 Conference, Berlin, Germany, April 17-19, 2000, pp. 153-158.
  • Clech, J-P., "Solder joint reliability of CSP versus BGA assemblies", in Proceedings, System
    Integration in Micro Electronics, SMT ESS & Hybrids Conference, Nuremberg, Germany, June 27-29, 2000, pp. 19-28.
  • Clech, J-P., “Solder Reliability Solutions: a PC-based design-for-reliability tool”, Proceedings, Surface Mount International Conference, Sept. 8-12, 1996, San Jose, CA, Vol. I, pp. 136-151. Also in Soldering and Surface Mount Technology, Wela Publications, British Isles, Vol. 9, No. 2, July 1997, pp. 45-54.
  • Darveaux, R. and Banerji, K., "Constitutive relations for tin-based solder joints", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 6, December 1992, pp. 1013- 1024.
  • Darveaux, R., Banerji, K., Mawer, A. and Dody, G., "Reliability of plastic ball grid array assemblies", Chap. 13, Ball Grid Array Technology, ed. J. H. Lau, McGraw-Hill, 1995, pp. 379-442.
  • DeVore, J. A. and Westerman, L., Solder and Solder Joint Properties Handbook, GE, Electronics Laboratory, Syracuse, NY, Sept. 1980.
  • Foley, J. C., Gickler, A., Leprevost, F. H. and Brown, D., "Analysis of ring and plug shear strengths for comparison of lead-free solders", Journal of Electronic Materials, Vol. 29, No. 10, 2000, pp. 1258- 1263.
  • Glazer, J., "Metallurgy of low temperature Pb-free solders for electronic assembly", IMR/273, The Institute of Materials and ASM International, 1995, pp. 65-93.
  • Glazer, J., "Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: a review", Journal of Electronic Materials, Vol. 23, No. 8, 1994, pp. 693-700.
  • Guo, F., Lucas, J. P. and Subramanian, K. N., "Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints", Journal of Materials Science: Materials in Electronics, Vol. 12 (2001), pp. 27-35.
  • Hall, P. M., "Strain measurements during thermal chamber cycling on leadless ceramic chip carriers soldered to printed boards", Proceedings, 34th Electronic Components Conference, New Orleans, LA, May 14-16, 1984, pp. 107-116.
  • Hall, P.M., “Forces, moments, and displacements during thermal chamber cycling of leadless ceramic chip carriers soldered to printed boards”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1984, Vol. 7, No. 4, Dec. 1984, pp. 314-327.
  • Hernandez, C. L., Vianco, P. T. and Rejent, J. A., "Effect of interface microstructure on the mechanical on the mechanical properties of Pb-free hybrid microcircuit solder joints", Proceedings, IPC / SMTA Electronics Assembly Expo, October 27-29, 1998, Providence, RI, pp. S19-1-1 to S19-1-8.
  • Igoshev, V. I. and Kleiman, J. I., "Creep phenomena in lead-free solders", Journal of Electronic Materials, Vo. 29, No. 2, 2000, pp. 244-250.
  • ITRI, "Mechanical properties of solders and solder joints", International Tin Research Institute, Publication No. 656.
  • Jones, W. K., Liu, Y. and Shah, M., "Mechanical properties of Pb/Sn Pb/In and Sn-In", Soldering and Surface Mount Technology, Vol. 10, No. 1, February 1998, pp. 37-41.
  • Joo, D. K. and Yu, J., "Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders", on CD-ROM, Proceedings, 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002.
  • Kariya, Y. and Otsuka, M., "Mechanical fatigue characteristics of Sn-3.5Ag-X (X = Bi, Cu, Zn and In) solder alloys", Journal of Electronic Materials, Vol. 27, No. 11, 1998, pp. 1229-1235.
  • Kariya, Y. and Plumbridge, W. J., "Mechanical properties of Sn-3.0mass%Ag-0.5mass%Cu alloy", Proceedings, 7th Symposium on Microjoining and Assembly Technology in Electronics, Feb. 1-2, 2001, Yokohama, Japan, pp. 383-388.
  • Kim, K. S., Huh, S. H. and Suganuma, K., "Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys", to appear in Materials Science and Engineering, A000 (2001) 000-000, Elsevier Science B. V.
  • Lau, J. H. and. Pao, Y-H., Solder Joint Reliability of BGA, CSP, Flip Chip. and Fine Pitch SMT Assemblies, McGraw-Hill, 1997, ISBN 0-07-036648-9.
  • Low, S. R. and Fields, R. J., "Multiaxial mechanical behavior of 63SSn-37Pb solder", Proceedings, 41st Electronic Components and Technology Conference, 1991, Atlanta, GA, pp. 292-298.
  • Mavoori, H., Chin, J., Vaynman, S., Moran, B., Keer, L. and Fine, M., "Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders", Journal of Electronic Materials, Vol. 26, No. 7, 1997, pp. 783-790.
  • NCMS Lead Free Solder Project, NCMS Report 0401RE96 (on CD-ROM), June 1998.
  • Neu, R. W., Scott, D. T. and Woodmansee, M. W., "Thermomechanical behavior of 96Sn-4Ag and Castin Alloy", ASME Transactions, Journal of Electronic Packaging, Vol. 123, No.3, September 2001, pp. 238-246.
  • NIST-Boulder database, " Database for Solder Properties with Emphasis on New Lead-free Solders", Properties of Lead-Free Solder, Release 3.0, May 31, 2001, by T. Siewert, S. Liu, D. R. Smith and J. C. Madeni, National Institute of Standards and Technology & Colorado School of Mines, available on the web at: http://www.boulder.nist.gov/div853/
  • Pao, Y-H., Badgley, S., Baumgartner, L., Allor, R. and Cooper, R., “Measurement of mechanical behavior of high lead lead-tin solder joints subjected to thermal cycling”, ASME Transactions, Journal of Electronic Packaging, June 1992, Vol. 114, pp. 135-144.
  • Pao, Y-H., Badgley, S., Govila, R. K. and Jih, E., "Thermomechanical and fatigue behavior of four lead and lead-free solder joints", ASME EEP- Vol. 4-2, Advances in Electronic Packaging, Proceedings of the 1993 ASME International Electronic Packaging Conference, Binghamton, NY, September 29 - October 2, 1993, vol. 2, pp. 937-949.
  • Park, T. S. and Lee, S-B., “Isothermal low cycle fatigue tests of Sn/3.5Ag/0.75Cu and 63Sn/37Pb solder joints under mixed-mode loading cases”, on CD-ROM, Proceedings, 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002.
  • Plumbridge, W. J. and Gagg, C. R., "Effects of strain rate and temperature on the stress-strain response of solder alloys", Journal of Materials Science: Materials in Electronics, No. 10, 1999, pp. 461-468.
  • Plumbridge, W. J., "Solders as high temperature engineering materials", Materials at High
    Temperatures, Science Reviews, 2000, No. 17(3), pp. 381-387.
  • Ren, W., Lu, M., Liu, S. and Shangguan, D., "Themal mechanical property testing of new lead-free solder joints", Soldering and Surface Mount Technology, Vol. 9, No. 3, October 1997, pp. 37-40.
  • Schubert, A., Walter, H., Dudek, R., Michel, B., Lefranc, G., Otto, J. and Mitic, G., "Thermomechanical properties and creep deformation of lead-containing and lead-free solders", Proceedings, 2001 International Symposium on Advanced Packaging Materials, pp. 129-134.
  • Surface Evolver program, available at: http://www.geom.umn.edu/software/download/evolver.html, with additional information under the web site of the NIST solder joint design program at: http://www.ctcms.nist.gov/programs/solder.
  • Villain, J., Bruller, O. and Qasim, T., "Creep deformation of the lead-free solder alloy Sn-3.5Ag at high homologues temperatures using laser extensometry with miniprobes", Proceedings, SMT ES&S Hybrid Conference, Nuremberg, Germany, June 27-29, 2000, pp. 143-147.
  • Warwick, M., "Implementing lead free soldering - European consortium research", SMTA, Journal of SMT, Volume 12, Issue 4, October 1999, pp. 1-12.
  • Wen, S., "Thermomechanical fatigue life prediction for several solders", Ph.D. dissertation,
    Department of Mechanical Engineering, Northwestern University, Evanston, IL, 2001.
  • Whitelaw, R. S., Neu, R. W. and Scott, D. T., "Deformation behavior of two lead-free solders: Indalloy 227 and Castin alloy", ASME Transactions, Journal of Electronic Packaging, 1999, Vol. 121, pp. 99- 107.
  • Wiese, S., Schubert, A., Walter, H., Dudek, R., Feustel, F., Meusel, E. and Michel, B., "Constitutive behavior of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints", Proceedings, 51st Electronic Components and Technology conference, Orlando, FL, 2001, pp. 890-902.
  • Wong, B., Helling, D. E. and Clark, R. W., “A creep rupture model for two-phase eutectic solders”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. II, No. 3, Sept. 1988, pp. 284-290.
  • Yang, H., Deane, P., Magill, P. and Murty, K. L., “Creep deformation of 96.5Sn-3.5Ag solder joints in a flip-chip package”, Proceedings, 1996 Electronic Components and Technology Conference, pp. 1136-1142.
  • Yang, W., Felton, L. E. and Messler, Jr., R. W., "The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints", Journal of Electronic Materials, Vol. 24, No. 10, 1995, pp. 1465-1472.

Materials Science and Engineering Division | metallurgy@nist.gov
Home | Personnel | Research Opportunities


The National Institute of Standards and Technology (NIST) is an agency of the U.S. Commerce Department.
Privacy policy / security notice / accessibility statement / Disclaimer / Freedom of Information Act (FOIA) / No Fear Act Policy /
ExpectMore.gov (performance of federal programs) / NIST Information Quality Standards

Last modified: by Metallurgy Webmeister