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Introduction  
Sn-Pb Properties and Models  
Sn-Ag Properties and Creep Data  
Sn-Ag-Cu Properties and Creep Data  
General Conclusions/ Recommendations  
Acknowledgements  
References  
     
  For more information contact:  
  metallurgy@nist.gov  
 
Sn-Ag-Cu Properties and Creep Data
 
  Overview  
  "SAC" Creep Data  
  Source and Plot of Data  
  Specimens  
  Microstructures  
  Test Procedures  
  "SAC" Creep Data Analysis and Modeling  
  Fit of Kariya's and Schubert's Models  
  Review of SAC Data  
  Regression Analysis  
  Fit of Additional Data to First Order Creep Model  
  Kim et al.'s Data and Effect of Cooling Rate  
  NCMS' Compression Creep Data  
  Flip-Chip Solder Joint Shear Data  
  Addemdum: Microstructure and Cooling Rate Effects  
  Other "SAC" Properties  
  Young's Modulus vs. Temperature  
  Poisson's Ratio  
  Coefficients of Thermal Expansion (CTE)  
  Other Physical Properties  
  Conclusions on SAC Properties  
 

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