This webpage contains a collection of calculated binary and ternary
systems that are relevant to solders. The thermodynamic descriptions
of these systems are compiled in database files which can be downloaded.
Selected papers are available in the Phase
Diagram Research Publications section.
|Review and Analysis of Lead-Free Solder Material Properties
This report summarizes a review and analysis of material properties and
isothermal creep data for precipitate-strengthened lead-free solders. The
review focuses on the binary Sn-3.5Ag eutectic alloy and ternary
near-eutectic Sn-Ag-Cu alloys of composition close to that of the
NEMI-selected Sn-3.9Ag-0.6Cu alloy. The intricacies of the development of
constitutive and life prediction models for solder joints of electronic
assemblies are also discussed through a review of near-eutectic Sn-Pb
properties. This report was prepared by Jean Paul Clech through funding
support from the National institute of Standards and Technology. The need
for this critical evaluation of mechanical property data of Pb-free solders
was established through the NEMI-NIST-NSF-TMS Workshop on Modeling and Data
Needs for Lead-Free Solders.
for Solder Properties with Emphasis on New Lead-free Solders in PDF (1.3 MB)
The purpose of this web site will be to provide an on-line database
for solder properties emphasizing new lead-free solders. Presently under construction.
|NIST Recommended Practice Guide
on Test Procedures for Developing Solder Data
This publication documents standardized test procedures that can
produce valid and reproducible mechanical-property data for lead-free
solders. Such data speeds the application of lead-free solders
in high-volume, automated production of electronic assemblies,
especially when current production expectations combine high levels
of quality with the lowest cost. Use of standardized procedures
facilitates the comparison of data between laboratories and permits
the combination of data from different sources into
a single, comprehensive database.
Properties of Intermetallic Compounds Formed Between Tin (Solder)
and Copper or Nickel
Three intermetallic compounds (Cu6
) commonly found in solder joints
have been prepared by gas atomization and then consolidated into
bulk forms with microstructures similar to those observed in actual
joints. Physical and mechanical properties relevant to the performance
of joints have been measured for these materials. These data are
evaluated in light of previously reported results, appropriate
theories, and with regard to their applicability to actual layers
in solder joints.
10 July 2012
by Metallurgy Webmeister